Qianli Japan Laser Tech CPU BGA Reballing Gold Stencil For A8/A9/A10/A11/A12

This is Japan High Precision BGA Reballing Stencil Template 0.12mm for iPhone A11 CPU ,can be heat directly.

Thickness: 0.12mm

Material: High Quality Stainless Steel

Hole Cut: Cubic-cut

Made in Japan

Large Quantity Lead Time Around one Week