The 24K gold-plated foil is needed for solder explosion when reballing, tin adhesion, and avoiding pressing due to a crooked motherboard. Improve working efficiency for the master lower skill dependency for the green bird.
Highlights:
-24K gold-plated process.
-Better anti-oxidation and conductivity.
-Achieve a more stable solder explosion-proof.
Feature:
Support middle frame, chips, and BGA.
Clamp the foil as easily as falling off a log.
The backbone of the precise electronics hardware.
Small size and great efficiency, solder explosion-proof.
Applied to all electronic components required lamination.
More stable alignment, motherboard slight deformation worry-free.
