Mijing BGA Reballing Stencil Platform for iPhone 13 series is convenient and faster for reballing BGA without any damage, offers you the best solution for iPhone 13 series BGA reballing and repairing
How to use:
Install the main board on the platform
Cover the BGA reballing stencil on the mainboard
Evenly spread tin on the cover of the reballing stencil
Remove the reballing stencil cover
Take out the motherboard and cooperate with the hot air gun to solidify the tin point
