SUNSHINE SS-032 MIDDLE BOARD BGA REBALLING SET FOR IPHONE X/XS/XSMAX

Feature:

• Solder paste melting point of 158 ° C, specially designed for IPHONE X, the middle layer special low temperature solder paste, which has strong welding ability, high density and strong activity.
• The planting platform has strong magnetic adsorption, the high temperature resistant synthetic stone is neatly cut, and the heat dissipation is good. Both sides can be used, compact and light.
• SUNSHINE SS-320 is dedicated to repairing IPHONE X XS XS MAX series