Mechanic Layer Bonding Tool Sets

Intelligent temperature control preheating platform

Layering, tin planting, bonding, desoldering, and glue removal are integrated, and it is equipped with controllable temperature / module expansion design / no air gun and no soldering iron I plug and play technology

Intelligent adjustable temperature, custom debugging temperature, debugging temperature according to different melting points

No air gun, no soldering iron, fast and accurate layered tin planting in 3 minutes to fit the motherboard

Modular design, multiple combination modules, good scalability, easy to expand new modules

Plug and play technology, the device supports hot swap, making your work more efficient

Scope of application: latest support for IP X/XS/XS Max/11/11 Pro/11 Pro Max/12 mini/12/12 Pro/12 Pro Max /13 /13mini /13 Pro /13PROMAX/14 14mini 14 Pro 14PROMAX/15/ 15PIUS/ 15 Pro 15PROMAX

motherboard layering. Fitting. Dot matrix repair