QianLi Bumblebee BGA Reballing Stencil Planting Tin (QS162) for HUAWEI Qualcomm Snapdragon 778G SM7325 CPU Universal Series
616" bss-b2b-product-handle="qianli-bumblebee-bga-reballing-stencil-planting-tin-qs162-for-huawei-qualcomm-snapdragon-778g-sm7325-cpu-universal-series" bss-b2b-variant-id="" bss-b2b-current-variant-price>
QianLi Bumblebee BGA Reballing Stencil Planting Tin (QS162) for HUAWEI Qualcomm Snapdragon 778G SM7325 CPU Universal Series
Grade: Wholesale quality · SYD: Low Stock · MEL: Low Stock
Professional repair tool — dropshipped from our Australian partner.