Qianli Japan Laser Tech CPU BGA Reballing Gold Stencil For A8/A9/A10/A11/A12
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This is Japan High Precision BGA Reballing Stencil Template 0.12mm for iPhone A11 CPU ,can be heat directly.
Thickness: 0.12mm
Material: High Quality Stainless Steel
Hole Cut: Cubic-cut
Made in Japan
Large Quantity Lead Time Around one Week