Suitable for high-end machine motherboards/electronic components/BGA chips/SMT maintenance, etc.
Product Size: 32x32x38.4mm
Melting Point: 138℃
- Good wettability, strong viscosity
- Preferred raw materials, lead-free and environmentally friendly
- Accurate temperature, effective protection of circuit board components
- Low temperature tin planting
- 138℃ low melting point, accurate temperature, effective protection of circuit board components.